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| EMIF10-LCD03F3 10-line IPADTM, EMI filter and ESD protection Features High attenuation in the mobile frequency range (typically better than -40 dB from 900 MHz to 2 GHz) Very low clamping voltage Low line capacitance (30 pF max) suitable for high-speed interfaces Maximum rise and fall time: 6 ns (10% - 90%) Compliant with high speed data rate Lead-free Flip Chip package in 400 m pitch Very thin package: 0.6mm thickness Flip Chip (24 bumps) Description The EMIF10-LCD03F3 is a 10-line highly integrated LC filter designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The EMIF10 Flip Chip packaging means the package size is equal to the die size. This LC filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up 15 kV. Figure 1. Pin layout (bump side) 5 O1 O3 O5 O7 O9 Benefits High efficiency in EMI filtering High bandwidth: typically 200 MHz at -3 dB 80% space saving versus discrete solution (BOM reduction) High reliability offered by monolithic integration High reduction of parasitic elements through integration and wafer level packaging 4 O2 O4 O6 O8 O10 3 GND 2 I1 I3 1 I2 I4 I6 I8 I10 A B C D E Complies with the following standards IEC61000-4-2 level 4 on inputs and outputs - 15 kV (air discharge) - 8 kV (contact discharge) GND I5 I7 I9 GND GND Applications Displays and cameras where outstanding EMI filtering in ESD sensitive equipment is required: Figure 2. Device configuration Low-pass Filter 0000 Mobile phones and PDAs Personal and home entertainment (portable audio, DVD players, LCD TVs) Portable navigation devices Digital still cameras Portable gaming systems Input Output GND GND Ri/o = 125 20% Cline = 30 pF max GND TM: IPAD is a trademark of STMicroelectronics. April 2008 Rev 1 1/7 www.st.com 7 Characteristics EMIF10-LCD03F3 1 Characteristics Table 1. Symbol Absolute maximum ratings (Tamb = 25 C) Parameter Input and output pins: ESD discharge IEC 61000-4-2, air discharge ESD discharge IEC 61000-4-2, contact discharge Maximum junction temperature Operating temperature range Storage temperature range Value Unit VPP Tj Top Tstg 15 15 125 -40 to +85 -55 to 150 kV C C C Table 2. Symbol VBR IRM VRM VCL Rd IPP RI/O Cline Symbol VBR IRM RI/O Cline Electrical characteristics (Tamb = 25 C) Parameters Breakdown voltage IF I Leakage current @ VRM Stand-off voltage Clamping voltage Dynamic impedance Peak pulse current Series resistance between Input & Output Line capacitance Test conditions IR = 1 mA VRM = 3 V per line Tolerance 20% Vline = 0 V, VOSC = 30 mV, F =1 MHz 100 125 Min 14 200 150 30 Typ Max Unit V nA pF IPP VCL VBR VRM IRM IR VF V 2/7 EMIF10-LCD03F3 Characteristics Figure 3. 0.00 -10.00 -20.00 -30.00 -40.00 -50.00 -60.00 -70.00 -80.00 S21 measurement (all GND bumps connected) Figure 4. dB Analog crosstalk measurements (all GND bumps connected) dB 0.00 -10.00 -20.00 -30.00 -40.00 -50.00 -60.00 -70.00 -80.00 -90.00 -100.00 F (Hz) 100.0k I1-O1 I3-O3 I5-O5 I7-O7 I9-O9 -110.00 -120.00 1.0M 10.0M 100.0M I2-O2 I4-O4 I6-O6 I8-O8 I10-O10 1.0G -130.00 -140.00 100.0k I1-O2 1.0M 10.0M F (Hz) 100.0M I1-O10 1.0G Figure 5. ESD response to IEC 61000-4-2 (+15 kV air discharge) on one line Figure 6. ESD response to IEC 61000-4-2 (-15 kV air discharge) on one line Figure 7. Line capacitance versus applied voltage (typical values) 30 Cline (pF) F=1 MHz VOSC = 30 mVRMS TJ = 25 C 25 20 15 10 5 Vline (V) 0 0 1 2 3 4 5 3/7 Ordering information scheme EMIF10-LCD03F3 Figure 8. Typical rise and fall time: input voltage Figure 9. Typical rise and fall time: output voltage INPUT VOLTAGE X: 10 ns/DIV Y: 1 V/DIV OUTPUT VOLTAGE X: 10ns/DIV Y: 1V/DIV Trise10% -90% = 3.45 ns Tfall 90%-10% = 4.09 ns 2 Ordering information scheme Figure 10. Ordering information scheme EMIF EMI Filter Number of lines Information x = resistance value (Ohms) z = capacitance value / 10 (pF) or 3 letters = application 2 digits = version Package F = Flip Chip 3 = Lead-free, pitch = 400 m yy - xxx zz F3 4/7 EMIF10-LCD03F3 Package information 3 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com. Figure 11. Package dimensions 400 m 40 400 m 40 255 m 40 605 m 55 190 m 10 240 m 10 1.98 mm 30 m Figure 12. Footprint Copper pad Diameter: 220 m recommended 260 m maximum Solder mask opening: 300 m minimum Figure 13. Marking Dot, ST logo xx = marking z = manufacturing location yww = datecode (y = year ww = week) 2.08 mm 30 m E Solder stencil opening: 220 m recommended xxz y ww 5/7 Ordering information Figure 14. Flip Chip tape and reel specification Dot identifying Pin A1 location 4 0.1 EMIF10-LCD03F3 O 1.5 0.1 1.75 0.1 3.5 0.1 2.13 0.69 0.05 All dimensions in mm 8 0.3 STE STE STE xxz yww User direction of unreeling xxz yww xxz yww 4 0.1 2.22 Note: More information is available in the application notes: AN2348: "STMicroelectronics 400 micro-metre Flip Chip: Package description and recommendation for use" AN1751: "EMI Filters: Recommendations and measurements" 4 Ordering information Table 3. Ordering information Marking HI Package Flip Chip Weight 5.3 mg Base qty 5000 Delivery mode Tape and reel 7" Order code EMIF10-LCD03F3 5 Revision history Table 4. Date 14-Apr-2008 Document revision history Revision 1 Initial release Changes 6/7 EMIF10-LCD03F3 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 7/7 |
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